Semiconductor application installation adapted with a...

H - Electricity – 01 – L

Patent

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Details

H01L 23/46 (2006.01) F24J 3/08 (2006.01) F25B 30/00 (2006.01) H05K 7/20 (2006.01)

Patent

CA 2669375

The primary purpose of the present invention is to provide an fluid circulating installation adapted with a temperature equalization system and fluid transmission duct disposed in a heat carrier existing in solid or liquid state in the nature where presents comparatively larger and more reliable heat carrying capacity. The fluid passes through the solid or gas state semiconductor application installation to regulate the semiconductor application installation for temperature equalization, and flows back to the heat equalization installation disposed in the natural heat carrier of heat for the heat equalization installation providing good heat conduction in the natural heat carrier to provide the operation of temperature equalization regulating function on the backflow of the fluid.

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