Photopolymerizable & photocleavable resin and low stress...

Details Photopolymerizable & photocleavable resin and low stress... Photopolymerizable & photocleavable resin and low stress...

C - Chemistry, Metallurgy

08

F

C08F 20/36 (2006.01) A61K 6/083 (2006.01)

Patent

CA 2674349

This invention relates to photopolymerizable & photocleavable resin monomers and resin composite compositions, which feature by its unique balanced overall performance including very low polymerization shrinkage and very low shrinkage stress as well. The photoreactive moiety incorporated into such new resin's main frame enable to make the resin and/or the cured resin networks that are based upon such resin photocleavable. Thus the polymerization rate of free radical reaction for (meth)acrylate- based resin systems should be substantially reduced since it alter the network formation process and consequently allow the shrinkage stress getting relief significantly. In addition, it is expected that radically polymerizable resin systems containing such P&P resin would find wide range application in microelectronic, special coating and restorative dentistry where the dimensional stability and contraction stress within cured materials are critical to the total performance.

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