H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/66 (2006.01) G01R 1/073 (2006.01) G01R 31/28 (2006.01)
Patent
CA 2127234
ABSTRACT Bare Die Testing This invention relates to bare integrated circuit die testing apparatus of the kind comprising a testing station wherein a plurality of microbumps of conductive material are located on interconnection trace terminations of a multilayer interconnection structure, which terminations are distributed in a pattern corresponding to the pattern of contact pads on the die to be tested. To facilitate testing of the die before separation from a wafer using the microbumps, the other connections provided to an and from the interconnection structure have a low profile. (Fig.2)
Fetherstonhaugh & Co.
Plessey Semiconductors Limited
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