Thermal management system

H - Electricity – 05 – K

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H05K 7/20 (2006.01) F28D 15/02 (2006.01) F28D 15/04 (2006.01) G06F 1/20 (2006.01) H01L 23/427 (2006.01)

Patent

CA 2186488

A thermal management system (22) having an enclosure (24) comprising a pair of enclosure regions disposed on opposite surface of a flexible thermally conductive sheet (32). The enclosure regions are coupled together through an aperture (34) provided in the sheet. A liquid transporting material (50) is disposed within the enclosure and passes between the enclosure regions through the aperture. A liquid (60) is disposed on the liquid transporting material. One end portion of the thermally conductive sheet is adapted for thermal coupling to a heat source (22) and the opposite end portion is adapted for thermal coupling to a heat sink (12). Heat emanating from the heat source passes through the thermally conductive sheet to the liquid to convert the liquid to a vapor.

Un système (22) de gestion thermique comprend une enceinte (24) présentant une paire de régions d'enceinte disposées sur une surface opposée d'une plaque flexible (32) thermoconductrice. Les régions d'enceinte sont couplées ensemble par une ouverture (34) ménagée dans la plaque. Un matériau (50) de transport de liquide est disposé à l'intérieur de l'enceinte et passe entre lesdites régions d'enceinte par l'ouverture. Un liquide (60) est disposé sur le matériau de transport de liquide. Une partie terminale de la plaque thermoconductrice est adaptée pour former un couplage thermique avec une source de chaleur (22), et la partie terminale opposée est adaptée pour permettre un couplage thermique avec un puits thermique (12). La chaleur émanant de la source de chaleur passe à travers la plaque thermoconductrice jusqu'au liquide afin de convertir le liquide en une vapeur.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Thermal management system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal management system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal management system will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1900495

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.