Method for applying an electronic assembly to a substrate...

Details Method for applying an electronic assembly to a substrate... Method for applying an electronic assembly to a substrate...

G - Physics

06

K

G06K 19/077 (2006.01)

Patent

CA 2595796

The aim of said invention is to ensure a maximum accuracy for producing an electronic assembly based on a small-sized chip and for applying said assembly to an insulating substrate. Said aim is attained by a method for applying at least one electronic assembly consisting of a chip (4), which is provided with at least one electric contact (5, 5') arranged on the surface thereof, to a support called a substrate (7), wherein said contact is connected to a segment (3,3') of a strip conductor and said application is carried out by means of an application device (6) which holds and positions said substrate (7). The inventive method consists in forming the segment (3,3') of the strip conductor having a predetermined contour, in transferring said strip segment (3,3') to the application device (6), in grasping the chip (4) by means of the application device (6) for transporting the strip segment (3,3') in such a way that said strip segment (3,3') is applied to at least one contact (5, 5') of the chip (4), in placing the electronic assembly consisting of the chip (4) and the strip segment (3, 3') on the substrate (7) in a predetermined position an in inserting said chip (4) and the strip segment (3, 3') into substrate (7). The application device used for carrying out said method and a portable object comprising the electronic assembly applied according to the inventive method are also disclosed.

Le but de la présente invention est d'assurer une précision maximale tant au niveau de la fabrication d'un ensemble électronique à partir d'une puce de petites dimensions qu'à celui du placement d'un tel ensemble sur un substrat isolant. Ce but est atteint par un procédé de placement sur un support, appelé substrat (7), d'au moins un ensemble électronique constitué d'une puce (4) comportant au moins un contact électrique (5, 5') sur l'une de ses faces, ledit contact (5, 5') étant connecté à un segment (3,3') de piste conductrice, ledit placement étant effectué au moyen d'un dispositif de pose (6) maintenant et positionnant ledit ensemble sur le substrat (7), caractérisé en ce qu'il comprend les étapes suivantes: - formation d'un segment (3, 3') de piste conductrice ayant un contour prédéterminé, - transfert du segment (3, 3') de piste sur le dispositif de pose (6), - saisie de la puce (4) avec le dispositif de pose (4) portant le segment (3, 3') de piste de sorte que ledit segment (3, 3') de piste se place sur au moins un contact (5, 5') de la puce (4). - placement de l'ensemble électronique constitué de la puce (4) et du segment (3, 3') de piste à une position prédéterminée sur le substrat (7), - enfoncement de la puce (4) et du segment (3, 3') de piste dans le substrat (7). L'invention se rapporte également au dispositif de pose utilisé dans le procédé et à un objet portable comportant un ensemble électronique placé selon le procédé.

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