Method of attaching sensitive electronic equipment to the...

Details Method of attaching sensitive electronic equipment to the... Method of attaching sensitive electronic equipment to the...

B - Operations, Transporting

60

C

B60C 23/00 (2006.01) B60C 23/04 (2006.01)

Patent

CA 2291498

An attachment between a monitoring device and an innerliner of a tire includes the use of an epoxy adhesive that bonds the monitoring device directly to the inner surface of the innerliner of the tire. The innerliner is first roughened in a manner that provides a roughened portion of the innerliner without removing the entire thickness of the innerliner. The entire thickness of the innerliner is not removed because the innerliner is preferably more than 1/16 of an inch thick. The thickness of the innerliner allows the rigid cured epoxy to bond the monitoring device to the inner surface of the innerliner while allowing the innerliner to flex with the tire so as to not break the seal between the rigid epoxy and the innerliner. The monitoring device is preferably located at a low flex area of the tire to help avoid the problem of the innerliner flexing.

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