Anode structure for magnetron sputtering systems

Details Anode structure for magnetron sputtering systems Anode structure for magnetron sputtering systems

C - Chemistry, Metallurgy

23

C

C23C 14/35 (2006.01) C23C 14/56 (2006.01) H01J 37/34 (2006.01)

Patent

CA 2123479

An elongated anode structure having multiple points to which electrons are attracted is provided. The anode can be constructed of multiple wire brushes that are attached to a metal rod. Use of the anode in magnetron systems significantly reduces dielectric material build-up and improves film uniformity in both dc reactive and non-reactive sputtering. Moreover, the anode reduces overheating and increases the operation time of magnetron systems undergoing reactive sputtering of dielectric materials. In one embodiment, the magnetron system has a cylindrical cathode and a pair of elongated anodes positioned parallel to and equidistance from the cathode. The anode structure is particularly suited for sputtering uniform films of dielectric materials, including silicon dioxide and silicon nitride.

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