Integrated circuit packaging structure

Details Integrated circuit packaging structure Integrated circuit packaging structure

H - Electricity

01

L

H01L 25/04 (2006.01) H01L 23/495 (2006.01) H01L 25/10 (2006.01) H05K 1/14 (2006.01) H05K 3/30 (2006.01) H05K 1/18 (2006.01)

Patent

CA 2195038

A package structure for an integrated circuit according to the present invention comprises tape carriers 1a - 1e, and a pin 22 vertically mounted on a wiring board 2. LSIs 12 are mounted on the tape carriers 1a - 1e respectively. The tape carriers 1a - 1e comprise base films 13 respectively. External connection terminals 11 are provided on the base film 13 in a lattice. The external connection terminal 11 comprises a through hole 18 and a conductive pattern 17 provided on the inner surface of the through hole 18. The pins 22 vertically mounted on the wiring board 2 are inserted into the external connection terminals 11 of the tape carriers 1a - 1e. The external connection terminals 11a - 11e are electrically connected by the pins 22.

ne structure de boîtier pour un circuit intégré d'après la présente invention comprend des porte-bande 1a - 1e, et une broche (22) montée verticalement sur une carte (2). Des circuits LSI (12) sont montés sur les porte-bande 1a - 1e respectivement. Les porte-bande 1a - 1e intègrent un film de base (13). Des bornes de connexion externes (11) sont intégrées au film de base (13), dans un réseau. Les bornes de connexion (11) comportent un trou de passage (18) et un réseau de conducteurs (17) sur la surface interne du trou de passage (18). Les broches (22) montées verticalement sur la carte (2) sont insérées dans les bornes de connexion externes (11) des porte-bande 1a - 1e. Les bornes de connexion externes 11a - 11e sont reliées électriquement aux broches (22).

Affiliated with

Also associated with

Rating

Integrated circuit packaging structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit packaging structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit packaging structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1919697