High density connector and method of manufacture

Details High density connector and method of manufacture High density connector and method of manufacture

H - Electricity

01

R

H01R 13/58 (2006.01) H01R 13/40 (2006.01)

Patent

CA 2404792

Electrical connectors capable of being mounted on circuit substrates (204) by BGA techniques are disclosed. Also disclosed is a method for manufacturing such connectors. There is at least one recess (20, 22, 24) on the exterior side of the connector elements (12). A conductive contact (66) extends from adjacent the interior side into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls (82) is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portion of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the central portions of the contacts to promote uniformity of solder volume.

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