Soldering alloy

B - Operations – Transporting – 23 – K

Patent

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Details

B23K 35/22 (2006.01) B23K 1/06 (2006.01) B23K 1/08 (2006.01) B23K 1/19 (2006.01) B23K 3/02 (2006.01) B23K 3/06 (2006.01) B23K 35/26 (2006.01) C04B 37/00 (2006.01) C04B 37/02 (2006.01)

Patent

CA 2370770

A new soldering technique and solder alloy for wetting and joining hard-to-wet materials including titanium alloys such as nitinol uses a solder alloy containing tin and an active wetting promoting element such as aluminum in the presence of ultrasound. As shown in the Figure, molten solder alloy (10) is applied to the hard-to-wet material (18) with the application of ultrasonic energy (14) which removes coatings (20) such as tenacious surface oxides to leave the base material (18) which is readily wetted by the solder alloy (20).

L'invention concerne une nouvelle technique de brasage et un nouvel alliage de brasage permettant de mouiller et de joindre des matériaux difficiles à mouiller, y compris les alliages de titane tels qu'un nitinol. Selon l'invention, on utilise un alliage de brasage contenant de l'étain et un élément actif favorisant le mouillage, tel que l'aluminium, en présence d'ultrasons. Comme le montre la figure, l'alliage de brasage (10) en fusion est appliqué sur le matériau (18) difficile à mouiller, avec apport d'une énergie ultrasonore (14) qui enlève des couches (20) telles qu'une couche superficielle d'oxydes tenaces pour laisser le matériau de base (18) à nu, lequel est facilement mouillé par l'alliage de brasage (20).

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