Low adhesion semi-conductive electrical shields

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

C08L 23/08 (2006.01) C08K 3/04 (2006.01) C08L 31/04 (2006.01) C08L 33/08 (2006.01) C08L 33/10 (2006.01) H01B 1/06 (2006.01) H01B 1/24 (2006.01) H01B 3/18 (2006.01) H01B 3/42 (2006.01) H01B 3/44 (2006.01) H01B 9/02 (2006.01)

Patent

CA 2425491

A low adhesion semiconductive dielectric shield for use with cross-linked polyethylene, ethylene-propylene-diene rubber (EPDM rubber) insulation. The dielectric shield comprises a base polymer which is a copolymer of ethylene with a mono-unsaturated ester; a conductive filler in an amount sufficient to give an electrical resistivity below 550 ohms-meter and as an adhesion adjusting device an ethylene vinyl acetate, ethylene alkyl methacrylate copolymer having a molecular weight above 20,000 daltons and a polydispersity greater than 2.5 wherein the adhesion between the insulation and the semiconductive shield is between about 3-26 lbs per 1/2 inch.

L'invention concerne un blindage diélectrique semiconducteur faible adhésion pouvant être utilisé avec une isolation en polyéthylène, en caoutchouc éthylène-propylène ou en caoutchouc éthylène-propylène-diène (caoutchouc EPDM). Le blindage diélectrique comprend un polymère de base, lequel consiste en un copolymère d'éthylène comprenant un ester monoinsaturé; une charge conductrice en quantité suffisante pour conférer une résistivité électrique inférieure à 550 ohms-m et, en guise, de dispositif de réglage de l'adhésion, un copolymère éthylène-acétate de vinyle, éthylène-acrylate d'alkyle, éthylène-acrylate de méthyle présentant un poids moléculaire supérieur 20 000 daltons et une polydispersité supérieure à 2,5, l'adhésion entre l'isolation et le blindage semi-conducteur étant comprise entre 3 et 26 lbs par 1/2 pouce.

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