Method of bonding a layer of material to a substrate

Details Method of bonding a layer of material to a substrate Method of bonding a layer of material to a substrate

B - Operations, Transporting

29

C

B29C 65/16 (2006.01) B23K 26/20 (2006.01) B29C 65/00 (2006.01) B29C 65/02 (2006.01) B44C 1/02 (2006.01)

Patent

CA 2328793

An improved method of bonding a layer of material to a substrate is provided in which a laser beam is used to generate heat in a local area on the composite. The heat from the laser beam activates an adhesive to bond the layer to the substrate. Alternatively, the heat from the laser beam locally melts either or both of the substrate and the layer to create the bond. When the bond is created along a closed path, the heat from the laser may also cause the layer to puff away from the substrate. The invention can be used for a variety of purposes such as creating decorative features on greeting cards to give them a novel look and feel.

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