C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
204/167.5
C23C 14/34 (2006.01) C23C 14/56 (2006.01)
Patent
CA 2128850
A sputter coating target which alleviates the need for anode reconditioning due to a buildup of a nonconductive coating comprises a coating component which itself or its reactive product is substantially electrically nonconductive and a dopant component which itself or its reactive product is substantially electrically conductive.
Pulvérisation cathodique qui élimine la nécessité de reconditionner une anode en raison de l'accumulation d'une couche de revêtement non conductrice. Le procédé de pulvérisation consiste à utiliser un composant de revêtement qui, ainsi que son produit réactif, n'a essentiellement aucune conductivité électrique et un dopant qui, ainsi que son produit réactif, offre essentiellement une conductivité électrique.
Hartig Klaus W.
Lingle Philip J.
Guardian Industries Corp.
Nexus Law Group Llp
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