Thermosetting composition

Details Thermosetting composition Thermosetting composition

C - Chemistry, Metallurgy

08

L

400/4602

C08L 79/04 (2006.01) C08F 283/00 (2006.01) C08F 283/10 (2006.01) C08L 63/00 (2006.01) C08L 79/08 (2006.01) H05K 3/28 (2006.01)

Patent

CA 2007178

THERMOSETTING COMPOSITION ABSTRACT A liquid, thermosetting composition is disclosed which contains (a) 10-70 % by weight of an epoxy resin, (b) 10-70 % by weight of a maleimide-triazine resin, (c) 5-60 % by weight of a polymerizable compound having at least two acrylate or methacrylate groups, and (d) 0.1-10 % by weight of a radical polymerization initiator, the amount of each of ingredients (a) through (d) being based on the total weight of ingredients (a) khrough (c). The composition gives a solid, thermosetting resin when heated at a low temperature or when irradiated by actinic light by reaction of ingredients (c) and (e), and the solidified resin in turn affords a cured resin having good moisture- proofing and insulting properties when heated at a high temperature by reaction of ingredients (a) and (b).

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