Material for a structure

Details Material for a structure Material for a structure

B - Operations, Transporting

32

B

B32B 27/04 (2006.01) C08G 8/24 (2006.01) C08G 14/06 (2006.01) C08J 5/04 (2006.01) C08J 5/24 (2006.01) C08J 9/00 (2006.01) C08L 61/06 (2006.01) C08L 61/20 (2006.01)

Patent

CA 2083508

[ABSTRACT] The object of the invention is to provide a material for a structure which can be molded at a low temperature. As a means to attain this object, in the present invention, a compound containing one or those of the methylol group and a resorcinol compound and/or a primary condensation product of the resorcinol compound and formaldehyde are mixed in a porous material as a binder. In the binder, the methylol group of the compound may react with the resorcinol compound and/or the primary condensation product of the resorcinol compound and formaldehyde to be cured at a low temperature for a short time. Accordingly, in the present invention, the material for a structure can be molded at a low temperature. - 27 -

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