Soldering method

Details Soldering method Soldering method

B - Operations, Transporting

23

K

B23K 1/005 (2006.01) B23K 26/00 (2006.01) B23K 26/06 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2104666

The present invention relates to a method of soldering electronic components to each other. When a member to be bonded is soldered to a base material by irradiating the member to be bonded with laser lights, the laser lights are incident upon a laser light transmittable probe and are emitted from the front end of the probe and the front end of the probe is in substantial contact with a solder or the member to be bonded.

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