Resin for bonding polyarylene sulfide and adhesive

C - Chemistry – Metallurgy – 08 – G

Patent

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Details

C08G 81/00 (2006.01) C08G 75/02 (2006.01) C08L 67/00 (2006.01) C08L 81/02 (2006.01) C09J 181/02 (2006.01)

Patent

CA 2067664

ABSTRACT OF THE DISCLOSURE A resin for bonding polyarylene sulfides is disclosed, comprising a copolymer wherein a main consti- tuent element of the repeating unit of the copolymer is -A-Z-R-Z-, wherein -Z- is an ester linkage; A is an arylene sulfide oligomer component block comprising one or more arylene groups; and R is an organic compound residue formed by removing one atom or one group attached to each of two carbon atoms among carbon atoms constituting either an aliphatic main chain or an aromatic ring and has at most a molecular weight corre- sponding to an oligomer, but is different from A. An adhesive comprising the resin and a pyrrolidone solvent is also disclosed. - 60 -

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