C - Chemistry – Metallurgy – 01 – B
Patent
C - Chemistry, Metallurgy
01
B
C01B 31/06 (2006.01) C23C 16/01 (2006.01) C23C 16/02 (2006.01) C23C 16/27 (2006.01)
Patent
CA 2042210
RD-19567 Abstract of the Disclosure The bond strength between a diamond and the substrate onto which it is deposited by the chemical vaporization method is decreased to the point where the diamond can be removed from the substrate as a free standing monolithic sheet. The bond strength can be decreased by polishing the substrate, removing corners from the substrate, slow cooling of the substrate after deposition, an intermediate temperature delay in cooling or the application or formation of an intermediate layer between the diamond and the substrate. The free standing sheet of diamond can be used as a laser lens, metallized to form a mirror, or silver soldered to tungsten carbide to form a cutting tool.
Anthony Thomas R.
Fleischer James F.
Company General Electric
Craig Wilson And Company
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