Copper coatings to improve peel strength

Details Copper coatings to improve peel strength Copper coatings to improve peel strength

H - Electricity

05

K

H05K 3/38 (2006.01) B32B 15/20 (2006.01)

Patent

CA 2298684

A method is disclosed for providing an improved adherence, or peel strength, between copper foil and a circuit board laminate having low dielectric and high glass transition temperature, through the use of an intermediate organic resin compound. Epoxy and phenoxy resins having average molecular weight in excess of 4500 are preferred to achieve necessary increases in peel strength for low dielectric circuit board laminate materials.

L'invention porte sur un procédé permettant d'obtenir, au moyen d'un composé intermédiaire de résine organique, une meilleure adhérence ou résistance au pelage entre des feuilles de cuivre et un laminé de carte de circuit présentant un diélectrique faible et une température de transition du verre élevée. On préfère des résines époxy et phénoxy dont le poids moléculaire moyen dépasse 4500 pour pouvoir accroître la résistance au pelage des matériaux laminés à faible diélectrique des cartes de circuit.

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