Surface mount assembly for electronic components

Details Surface mount assembly for electronic components Surface mount assembly for electronic components

H - Electricity

05

K

H05K 1/18 (2006.01) H05K 1/11 (2006.01) H05K 3/12 (2006.01) H05K 3/34 (2006.01) H05K 1/00 (2006.01)

Patent

CA 2252866

A plurality of indentations 21, 22, and 23 are formed in one major surface of a printed board 1. A plurality of electrode pads 41, 42, 43, and 44 are provided on the one major surface and the bottom of the indentations. A plurality of solder portions 91, 92, 93, and 94 are formed on the respective electrode pads. A plurality of electronic components 5, 6, 7, and 8 each having a plurality of terminals are connected to the electrode pads in the corresponding indentations by means of the solder portions.

Une pluralité de cavités 21, 22 et 23 sont formées dans une surface principale d'une carte à circuit imprimé 1. Une pluralité de pastilles d'électrode 41, 42 et 43 se trouvent sur la surface principale et au fond des cavités. Une pluralité de parties à souder 91, 92, 93 et 94 sont formées sur les pastilles respectives d'électrode. Une pluralité de composants électroniques 5, 6, 7 et 8 ayant chacun une pluralité de bornes sont raccordés aux pastilles d'électrode dans les cavités correspondantes au moyen de parties à souder.

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