C - Chemistry – Metallurgy – 11 – D
Patent
C - Chemistry, Metallurgy
11
D
C11D 7/50 (2006.01) B08B 3/08 (2006.01) B08B 3/10 (2006.01) C11D 3/18 (2006.01) C11D 3/20 (2006.01) C11D 3/43 (2006.01) C11D 11/00 (2006.01) C23G 5/024 (2006.01) C23G 5/032 (2006.01) H05K 3/26 (2006.01) C11D 7/24 (2006.01) C11D 7/26 (2006.01)
Patent
CA 2096426
An industrial cleaning process in which a contaminant comprising soldering flux and/or adhesive tape residue is removed from a substrate contaminated therewith, for example, a printed circuit board contaminated with rosin flux, comprising: (A) con- tacting the substrate with a terpene-based cleaning composition which is substantially free of water-soluble organic material, for example, a surfactant, for a period of time sufficient to solubilize the contaminant; (B) removing the composition and solubilized contaminant from the substrate by contact with water having a temperature of about 70 ÀF to about 140 ÀF (but preferably lower) for a period of time of no longer than about 10 minutes to provide a substrate having a contamination rating of no greater than about 14 micrograms NaCl equivalent/square inch (MIL-P-28809A), and to thereby form a mixture comprising the composition, contaminant and water; and (C) separating the water from said mixture, the separated water being substantially free of water-sol- uble organic material and having a chemical oxygen demand of no greater than about 1,000 ppm, and also a cleaning process uti- lizing a cleaning composition comprising a major amount of a monobasic ester to clean surfaces that are contaminated with an organic residue.
Bolden Paul L.
Braddy John E.
Hayes Michael E.
Petroferm Inc.
Smart & Biggar
LandOfFree
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