Hot melt adhesive

Details Hot melt adhesive Hot melt adhesive

C - Chemistry, Metallurgy

09

J

C09J 129/08 (2006.01) C08G 18/12 (2006.01) C08G 18/34 (2006.01) C08G 18/36 (2006.01) C08G 18/40 (2006.01) C08G 18/62 (2006.01) C08G 18/72 (2006.01) C09J 127/06 (2006.01) C09J 135/02 (2006.01) C09J 175/08 (2006.01)

Patent

CA 2381688

A moisture reactive hot melt adhesive composition formed by admixing components including a polyisocyanate, an amorphous polyol, 1.3 to 6%, by weight based on the weight of the adhesive composition, tri-C1-C6-alkyl citrate, and 0.1 to 10%, by weight based on the weight of the adhesive composition, of certain styrene/allyl alcohol copolymers, wherein the ratio of NCO/OH groups of the components on an equivalents basis is from 1.05 to 2.5, the components being free from crystalline polyesters and polyethers and the components containing less than 1%, by weight based on the total weight of the components, of water is provided. Also a method for forming the adhesive composition and a method for bonding two substrates using the adhesive are provided

Affiliated with

Also associated with

Rating

Hot melt adhesive does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hot melt adhesive, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hot melt adhesive will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1971747