Method for reducing mold deposit formation during molding of...

C - Chemistry – Metallurgy – 08 – L

Patent

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C08L 77/10 (2006.01) C08K 3/16 (2006.01) C08K 5/13 (2006.01) C08K 5/18 (2006.01) C08K 13/02 (2006.01) C08L 23/02 (2006.01) C08L 77/00 (2006.01) C08L 77/06 (2006.01) C08L 53/00 (2006.01)

Patent

CA 2377494

An injection molding formulation comprising an impact modified, high temperature, partially aromatic polyamide, a hindered phenol, and a copper-containing stabilizer. The formulation exhibits lower production of thermal decomposition byproducts, thereby avoiding rapid build up of mold vent-clogging deposits.

L'invention concerne une formulation de moulage par injection qui renferme un polyamide antichoc partiellement aromatique haute température, un phénol encombré, et un agent stabilisateur contenant du cuivre. Cette formulation ne produit qu'une quantité réduite de sous-produits de la décomposition thermique, ce qui permet d'éviter toute accumulation de dépôts de moulage susceptible de boucher les évents.

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