Thermosetting resin forming compositions, resins therefrom...

Details Thermosetting resin forming compositions, resins therefrom... Thermosetting resin forming compositions, resins therefrom...

C - Chemistry, Metallurgy

08

G

C08G 73/12 (2006.01) C07D 207/452 (2006.01) C08L 79/08 (2006.01)

Patent

CA 2192394

Disclosed is a resin forming composition comprising ( i ) an aromatic diamine compound represented by the formula (I) Image (I) (wherein R is H or CH3) and (ii) a bismaleimide compound represented by the formula (IV) Image (IV) (wherein R is H or CH3) . A resin obtained from the composition may be used as a coating film, adhesive layer or molded article.

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