Solder placement apparatus and method

Details Solder placement apparatus and method Solder placement apparatus and method

B - Operations, Transporting

23

K

B23K 3/06 (2006.01) G02B 6/42 (2006.01) H02G 1/00 (2006.01)

Patent

CA 2260342

A solder placement device (10) forms a selected length of a solder wire (14) to be used in mounting an optical fiber (20) to a substrate 116 so that the optical fiber (2)) and a laser diode (22) may be optically coupled together. The solder placement device (10) includes casing (16) that contains a plunger (24) arranged for reciprocal movement along an axis in the casing (16). A solder input tube (30) guides solder (14) from a supply spool (12) to a leaf spring retainer (42) inside the casing (16). The leaf spring retainer (42) is mounted to the plunger (24) and arranged to allow unidirectional movement of the solder wire (14) along the axis such that movement of the plunger (24) toward the output end of the apparatus (10) pulls the solder wire (14) along with the plunger (24). When the direction of the plunger (24) reverses, the leaf spring retainer (42) slides along the solder wire (14), and the apparatus (10) resets to pull in another segment of the solder wire (14). A cutting mechanism (86) is actuated by movement of the plunger (24) along the axis to cut off a piece (18) of solder of the selected length. An output tube (87) is mounted to the casing (16) adjacent the cutting mechanism (86). The output tube (87) is arranged to receive the cut off piece (18) of solder wire (14) so that compressed air blows it out through an end 110 of the output tube (87).

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