Process and apparatus for coating printed circuit boards

Details Process and apparatus for coating printed circuit boards Process and apparatus for coating printed circuit boards

H - Electricity

05

K

H05K 3/06 (2006.01) G03F 7/16 (2006.01) H05K 3/00 (2006.01) H05K 3/12 (2006.01) H05K 3/22 (2006.01)

Patent

CA 2162712

A process for coating printed circuit boards is described, comprising the following process steps: - the printed circuit boards on the coating side are kept at room temperature and, as appro- priate, are heated to approximately 120°C; then - in a first step, a preferably photopolymerisable, meltable, low-molecular-weight coating composition that preferably has an average molecular weight of from 500 to 1500 and that is highly viscous to solid at room temperature is coated in a thickness of approximately from 10 µm to 200 µm on to the surface(s) of the printed circuit board to be coated; - in a second step, a second, high-molecular-weight, photopolymerisable coating composi- tion preferably having an average molecular weight of from 2000 to 10 000 is applied in a thickness of from 2 µm to 20 µm over the first layer, and - the printed circuit boards so coated are cooled to room temperature and the two-layer photopolymerisable coating is exposed, preferably in contact with a mask, is developed and is cured fully. An apparatus for carrying out the process outlined above is also described.

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