A polymerizable, curable molding composition and a molding...

Details A polymerizable, curable molding composition and a molding... A polymerizable, curable molding composition and a molding...

C - Chemistry, Metallurgy

08

L

C08L 63/10 (2006.01) C08F 290/14 (2006.01) C08J 9/32 (2006.01) C08K 5/07 (2006.01) C08K 13/02 (2006.01) C08L 67/06 (2006.01)

Patent

CA 2146745

The moulding compound of the invention contains (A) 100 parts by weight of an unsaturated epoxy ester resin with an acid number below 3; (B) 10 to 40 parts by weight of phenoxyethylacrylate, 2-acroyloxyethyl-2-hydroxypropylphthalate or a mixture thereof; and (C) 1 to 5 parts by weight of a mixture of hydroxy ketone oligomers and 2-hydroxy-2-methyl-1-phenylpropan-1-one; and possibly (D) 0.5 to 5 parts by weight of polystyrene microbeads. The moulding compound can easily be cured by brief uv irra- diation and gentle heating. A synthetic resin is obtained with high heat and water resistance, good electrical insulating properties and low cracking and shrinkage. It is suitable for the production of electrical/electronic components.

Affiliated with

Also associated with

Rating

A polymerizable, curable molding composition and a molding... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with A polymerizable, curable molding composition and a molding..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and A polymerizable, curable molding composition and a molding... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1986719