H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/18 (2006.01) H05K 3/46 (2006.01)
Patent
CA 2520992
This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is glued (5) to the surface of a conductive layer, from which conductive layer conductive patterns (14) are later formed. After gluing the component (6), an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component (6), feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones (7) of the component. After this, conductive patterns (14) are made from the conductive layer, to the surface of which the component (6) is glued.
L'invention concerne un module électronique et un procédé de fabrication correspondant. Un composant (6) est collé (5) à la surface d'une couche conductrice, à partir de laquelle sont ensuite formés des motifs conducteurs (14). Une fois le composant (6) collé, on forme une couche de matériau isolant (1) entourant le composant (6) fixé à la couche conductrice, sur la surface de la couche conductrice, ou bien on la fixe à la surface de la couche conductrice, et on réalise également des traversées pour les contacts électriques entre la couche conductrice et les zones de contact (7) du composant. Ensuite, les motifs conducteurs (14) sont réalisés à partir de la couche conductrice à la surface de laquelle est collé le composant (6).
Palm Petteri
Tuominen Risto
Imbera Electronics Oy
Ogilvy Renault Llp/s.e.n.c.r.l.,s.r.l.
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