Power semiconductor device with heat dissipating property

Details Power semiconductor device with heat dissipating property Power semiconductor device with heat dissipating property

H - Electricity

01

L

356/112

H01L 23/34 (2006.01) H01L 23/427 (2006.01)

Patent

CA 2035724

A power semiconductor device such as power thyristor including a semiconductor substrate which is clamped by first and second conductive members serving as the electrodes as well as heat sinks, and a plurality of heat pipes whose one ends are inserted directly into the conductive members. A plurality of semiconductor substrates and temperature compensating plates are alternatively stacked one on another and conductive members are provided on outermost temperature compensat- ing plates to form an assembly. The assembly is hermetically sealed by an insulating package formed by an insulator having a corrugated outer surface such that outer surfaces of the conductive members are exposed out of the package. One or more heat pipes are inserted into the insulating package such that electrically insulating cooling medium filled in the heat pipes can be directly made into contact with the semiconductor substrates. The heat pipes may be inserted into the conductive members or heat sinks provided in the assembly.

Affiliated with

Also associated with

Rating

Power semiconductor device with heat dissipating property does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Power semiconductor device with heat dissipating property, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Power semiconductor device with heat dissipating property will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1994753