Method and apparatus for aligning a crystalline substrate

G - Physics – 03 – F

Patent

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Details

G03F 9/00 (2006.01) G01N 23/20 (2006.01)

Patent

CA 2392710

The invention provides an apparatus (10, 300) incorporating a lithographic tool (20) for printing a pattern from a mask (35) onto a substrate, for example a wafer (190), together with a substrate angle measuring tool (100, 310) employing X-ray diffraction techniques for determining substrate crystallographic orientation. The apparatus (10, 310) is calibrated so that the mask (35) is correctly angularly orientated with respect to the measuring tool (100, 310). When a new substrate (190) is loaded into the apparatus (10, 310) for having the pattern from the mask (35) printed thereonto, the apparatus (10, 300) angularly aligns the substrate (190) relative to the measuring tool (100, 310), thereby also aligning it angularly to the mask (35). The apparatus (10, 300) does not utilise any flats on the substrate for angular alignment purposes; as a consequence, the apparatus (10, 300) is capable of providing a high degree of accuracy when aligning crystal planes of the substrate (190) to features on the mask (35), the degree of accuracy approaching one minute of arc or better.

L'invention porte sur un appareil (10, 30) comprenant un outil lithographique (20) permettant d'imprimer un motif à partir d'un masque (35) sur un substrat, par exemple, une plaquette (190), et un outil de mesure (100, 310) d'angle de substrat utilisant des techniques de diffraction des rayons X en vue de déterminer l'orientation cristallographique du substrat. L'appareil (10, 310) est étalonné de sorte que le masque (35) soit orienté de manière angulaire correctement par rapport à l'outil de mesure (100, 310). Lorsque un nouveau substrat (190) est chargé dans l'appareil (10,310) afin d'y imprimer le motif à partir du masque (35), l'appareil (10, 300) aligne de manière angulaire le substrat (190) par rapport à l'outil de mesure (100, 310), ce qui l'aligne également de manière angulaire par rapport au masque (35). L'appareil (10, 300) n'utilise aucun à-plat sur le substrat pour réaliser un alignement angulaire ; en conséquence, l'appareil (10, 300) peut fournir un haut degré de précision lors de l'alignement des plans cristallins du substrat (190) sur des traits du masque (35), le degré de précision approchant une minute d'arc ou mieux.

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