Downhole servicing compositions having high thermal...

C - Chemistry – Metallurgy – 09 – K

Patent

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Details

C09K 8/42 (2006.01) C09K 8/04 (2006.01) E21B 33/13 (2006.01)

Patent

CA 2721480

A downhole servicing composition comprising from about 15 percent to about 80 percent by weight of a clay, and from about 10 percent to about 75 percent by weight of a carbon source is disclosed. The invention includes a downhole servicing composition comprising from about 15 percent to about 45 percent by weight of a first clay, from about 15 percent to about 45 percent by weight of a second clay, from about 10 percent to about 35 percent by weight of a filler, and from about 10 percent to about 75 percent by weight of a carbon source. The invention also includes a downhole servicing composition comprising an aqueous base and from about 10 percent to about 75 percent by weight of flaked graphite, wherein the downhole servicing composition has a thermal conductivity not less than about 0.8 BTU/hr-ft-°F.

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