Conveyorized vacuum applicator and method therefor

B - Operations – Transporting – 29 – C

Patent

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Details

B29C 43/56 (2006.01) B29C 43/20 (2006.01) H05K 3/28 (2006.01) H05K 3/02 (2006.01) B32B 31/14 (1995.01)

Patent

CA 2075526

A method of and apparatus that is continuously automatically operative in an in-line system is described for applying under heat, vacuum and mechanical pressure a photoresist-forming layer to printed circuit boards that already have been prelaminated by the loose application thereto of dry film as discrete cut sheets within the confines of the surface of the boards whereby a laminate without entrapped air bubbles and closely conforming to the surface contours such as circuit traces of the printed circuit board is obtained. Featured is a two-part conveyorized vacuum applicator comprising as one part two input conveyors in end-to-end relation and as the other part a belt conveyor and vacuum laminator. The belt conveyor is characterized in its use of an endless belt having an aperture therein through which, in the vacuum laminating condition of the applicator, the movable lower platen of the vacuum laminator is movable upwards into sealing contact with the upper platen of the laminator, with the printed circuit board to be laminated and a portion of the upper run of the endless belt contained within the vacuum chamber of the laminator.

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