Method of manufacturing circuit board

Details Method of manufacturing circuit board Method of manufacturing circuit board

H - Electricity

05

K

356/12

H05K 3/02 (2006.01) B23K 1/005 (2006.01) H05K 3/00 (2006.01) H05K 3/32 (2006.01) H05K 1/00 (2006.01) H05K 1/18 (2006.01) H05K 3/40 (2006.01)

Patent

CA 2027025

ABSTRACT A method is disclosed for the manufacturing of circuit boards. The method employs a pulsed or continuous beam laser for the perforation of the substrate material and employs gases for the removal of the subsequent sublimate and cooling of the substrate material.

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