Semiconductor wafer processing module

Details Semiconductor wafer processing module Semiconductor wafer processing module

H - Electricity

01

L

H01L 21/285 (2006.01) C23C 14/50 (2006.01) C23C 14/56 (2006.01) H01L 21/677 (2006.01) H01L 21/687 (2006.01)

Patent

CA 2102202

2102202 9221143 PCTABS00017 A sputtering module incorporated into a wafer processing system (10) includes an evacuatable housing (26) connectable to one or more other evacuatable housings and a wafer handling turret (32) adapted to receive a wafer (34) in horizontal orientation at a load/unload position (38) and rotate the wafer (34) 180· about an inclined axis (46) into vertical orientation at a sputtering position (48) across from a sputtering target (52). After sputter coating, the wafer handling turret (32) again rotates 180· about the inclined axis (46) to rotatably return the wafer (34) to the horizontal load/unload position (38), whereupon the wafer (34) is lowered to a horizontal receiving position for subsequent retrieval by an arm (21) extendible into the module from an adjacently situated housing (20). The wafer handling turret (32) includes three wafer rings (85) and a disc-shaped shutter (44) that is rotatably located in front of the target (52) during precleaning.

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