Method for producing implant structures for contacting or...

A - Human Necessities – 61 – N

Patent

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A61N 1/05 (2006.01) B81B 3/00 (2006.01)

Patent

CA 2643847

The aim of the invention is to provide a method for producing multilayers or multilayer systems, the structures produced on a substrate being easily removable from said substrate while remaining intact. For this purpose, the method for producing implant structures comprises the following steps: producing a first metal layer on a substrate, producing a second metal layer on top of the first metal layer, producing a plurality of multilayer implant structures on top of the second metal layer, removing the first metal layer between the substrate and the second metal layer and removing the implant structures from the substrate as a coherent structure. According to this method, a removable layer consisting of two or three metal layers is produced between the implant structures and the substrate, said metal layers being used as sacrificial layers when the finished multilayer is removed by an undercut process. The method according to the invention allows the finished multilayers to be evenly and reliably removed from the substrate as a coherent structure, thereby simplifying subsequent construction and connection techniques of the implant structures.

L'invention vise à mettre en oeuvre un procédé de fabrication de multicouches ou de systèmes multicouches selon lequel les structures produites sur un substrat peuvent être retirées ensemble du substrat, de façon simple, et sont conservées sous forme de composite. A cet effet, le procédé de fabrication de structures d'implant selon l'invention consiste à produire une première couche métallique sur un substrat; à produire une deuxième couche métallique sur la première; à fabriquer une pluralité de structures d'implant multicouches sur la deuxième couche métallique; à retirer la première couche métallique située entre le substrat et la deuxième couche métallique; et à retirer les structures d'implant par rapport au substrat, sous forme de composite solidaire. Selon l'invention, une couche de retrait composée de deux ou trois couches métalliques est créée entre les structures d'implant et le substrat, lesdites couches métalliques servant de couches sacrificielles lors du retrait des multicouches traitées, finies, au moyen d'un processus de sous-gravure. On obtient ainsi une séparation uniforme et fiable des multicouches finies, par rapport au substrat, sous forme de composite, ce qui simplifie les processus de montage et de liaison consécutifs des structures d'implant.

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