Surface mount header assembly

H - Electricity – 01 – R

Patent

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Details

H01R 12/22 (2006.01)

Patent

CA 2546800

A header assembly (200) includes an insulative housing (100) comprising a plurality of walls defining an interior cavity (108), and a plurality of contacts (150, 170) within said cavity and extending through one of the walls to an exterior of the housing for surface mounting to a circuit board. The insulating housing (100) comprises at least one alignment rib (136) extending on an exterior surface thereof. The contacts are formed to abut the alignment rib, thereby ensuring coplanarity of the contacts for surface mounting to a circuit board.

Cette invention concerne un ensemble embase (200) comprenant un logement isolant (100) comprenant une pluralité de parois définissant une cavité interne (108) ainsi qu'une pluralité de contacts (150, 170) situés à l'intérieur de cette cavité et traversant une des parois de façon qu'ils débouchent à l'extérieur du logement en vue du montage en surface sur une carte de circuits imprimés. Le logement isolant (100) comprend au moins une nervure d'alignement (136) s'étendant sur sa surface extérieure. Les contacts sont conçus pour buter contre la nervure d'alignement, ce qui garantit la coplanarité des contacts en vue du montage en surface sur une carte de circuits imprimés.

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