Low bridging soldering process

B - Operations – Transporting – 23 – K

Patent

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Details

B23K 35/14 (2006.01) B23K 35/26 (2006.01) B23K 35/363 (2006.01) B23K 35/38 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2099038

A process for wave soldering or reflow soldering comprising contacting substrates with a supply of molten solder containing from about 0.0001 to about 0.1% by weight of phosphorous in an atmosphere of diluent gas containing up to about 10% by volume oxygen. A reduced incidence of bridging and other soldering defects occurs.

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