Mounting structure for a semiconductor circuit

H - Electricity – 01 – L

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Details

H01L 23/12 (2006.01) H01L 23/495 (2006.01) H01L 25/16 (2006.01) H05K 1/18 (2006.01) H05K 1/14 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2202426

In a tape carrier package applying a TAB technique, a flex rigid PWB is used as a tape carrier. A flexible portion is provided with a semiconductor connection terminal. An LSI is directly mounted to the flexible portion. A rigid portion is provided with an electrode for mounting a component and an electrode for an external input/output.

Dans un ensemble appliquant une technique de transport automatique sur bande (TAB), une carte PWB flexo-rigide est utilisée comme bande. Une partie flexible est munie d'une borne de connexion de semiconducteur. Un LSI est monté directement sur la partie flexible. Une partie rigide est munie d'une électrode pour monter un composant et d'une électrode pour entrée/sortie externe.

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