Method and article for microwave bonding of splice closure

Details Method and article for microwave bonding of splice closure Method and article for microwave bonding of splice closure

B - Operations, Transporting

29

C

B29C 65/14 (2006.01) B29C 65/36 (2006.01) H02G 1/14 (2006.01) H02G 15/08 (2006.01) H05B 6/80 (2006.01)

Patent

CA 2123689

A method and article for microwave bonding of thermplastic closures such as that used in splicing telecommunications wires. The article is a composite bonding material (CBM) having a thermoplastic matrix (preferably polyethylene) which is miscible with the thermoplastic material of the closure, and a plurality of microwave susceptor particles dispersed throughout the matrix. A strip is fashioned from the CBM and may be applied to the sealing edges of the closure. Upon application of microwave energy in an amount sufficient to heat the susceptors and cause both the CBM matrix and the adjacent portion of the closure to melt and flow together, a fusion bond is produced which seals the closure. If the closure is being used with a cable having an inner conductive layer or sheath, a second CBM may be used at this seal, having magnetically reactive susceptors.

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