Amide mould release agents for injection moulding of...

C - Chemistry – Metallurgy – 08 – K

Patent

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C08K 5/20 (2006.01) B29C 33/62 (2006.01) B29D 17/00 (2006.01) C08G 69/48 (2006.01) C08L 79/06 (2006.01)

Patent

CA 2068441

ABSTRACT The injection molding process improved by including in the polymeric injecting molding material amide release agents of the structural formula R1-CO-NH-R2 where R1 and R2 are the same or different alkyl or alkenyl radicals each containing from about 9 to about 30 carbon atoms.

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