C - Chemistry – Metallurgy – 07 – K
Patent
C - Chemistry, Metallurgy
07
K
C07K 19/00 (2006.01) A61K 39/39 (2006.01) A61P 37/02 (2006.01) A61P 37/04 (2006.01)
Patent
CA 2734606
It is intended to provide polypeptide capable of inducing the potentiation of antibody production when transmucosally administered without resort to any immune adjuvants, a composition containing the polypeptide and use thereof. These objects can be achieved by establishing a polypeptide which is obtained by bonding the amino acid sequence of the adhesion motif of a cell adhesion molecule to a polypeptide comprising a peptide consisting of the amino acid sequence of a multi-agretope type T cell epitope in its amino-terminal side and the amino acid sequence of a B cell epitope in its carboxyl-terminal side while having a linker peptide between these amino acid sequences, and providing a composition containing the polypeptide and use thereof.
Kabushiki Kaisha Hayashibara Seibutsu Kagaku Kenkyujo
Macrae & Co.
LandOfFree
Polypeptide comprising cell adhesion motif, t cell epitope... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Polypeptide comprising cell adhesion motif, t cell epitope..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polypeptide comprising cell adhesion motif, t cell epitope... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-2042468