Single tapered die mount

B - Operations – Transporting – 01 – J

Patent

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Details

B01J 2/00 (2006.01) A23P 1/02 (2006.01) B26D 7/26 (2006.01) B30B 11/20 (2006.01)

Patent

CA 2166029

The single tapered die mount employs a radially inner surface at an angle to the axis of rotation of the die mount, die and die holder. The radially inner surface of the die mount acts on an annular shoulder of the die to support and position the die in the die holder. The die mount of the invention is located between the radially outer surface of the die and the extended lip of the die housing. In the preferred embodiment of the invention, the radially inner surface of the die mount in contact with the radially outer surface of the die shoulder has an angle of a modified Morse taper. The radially outer surface of the die shoulder is machined to a matching angle.

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