Acidic solution for silver deposition and method for silver...

Details Acidic solution for silver deposition and method for silver... Acidic solution for silver deposition and method for silver...

C - Chemistry, Metallurgy

23

C

C23C 18/42 (2006.01) H05K 3/24 (2006.01)

Patent

CA 2481133

A processing solution and a method are used for producing solderable and bondable silver layers the properties of which are not degraded even after storing, with no anti-tarnishing compounds being utilized as contrasted with prior art solutions and methods. The acidic solution for silver deposition contains silver ions and at least one Cu(I) complexing agent, said Cu(I) complexing agent being selected from the group comprising compounds having the structural element (I).

Cette invention se rapporte à une solution et à un procédé de traitement servant à produire des couches d'argent soudables et agglomeárables dont les propriétés ne se dégradent pas même à l'entreposage, sans l'utilisation de composés anti-ternissement, à la différence des solutions et des procédés de l'état actuel de la technique. Cette solution acide pour le dépôt d'argent contient des ions d'argent et au moins un agent complexant de Cu(I), lequel est choisi dans le groupe des composés contenant l'élément structurel (I).

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