Cooling structure for integrated circuits

Details Cooling structure for integrated circuits Cooling structure for integrated circuits

H - Electricity

01

L

H01L 23/473 (2006.01) H01L 23/433 (2006.01)

Patent

CA 2070062

A cooling structure for an integrated circuit includes a wiring substrate and an integrated circuit mounted on the wiring substrate. Storage means for storing a liquid coolant, have an inlet and an outlet for the liquid coolant at the top thereof and an opening at the bottom thereof and adhering means for fastening together the bottom of the storing means and a heat radiating face of the integrated circuit. Spraying means, directly spray the liquid coolant on the heat radiating face of the integrated circuit through the opening.

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