C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 1/04 (2006.01) C25D 3/38 (2006.01) H05K 1/03 (2006.01) H05K 1/09 (2006.01)
Patent
CA 2041665
2041665 9104358 PCTABS00003 Copper conductive foil (20) for use in preparing printed circuit boards is electrodeposited from an electrolyte solution (18) containing copper ions, sulphate ions, animal glue and thiourea. The thiourea operates to decrease the roughness of the foil, to enable operation at higher current densities and/or to modify the ductility characteristics of the foil.
Clouser Sidney J.
Difranco Dino F.
Clouser Sidney J.
Difranco Dino F.
Gould Electronics Inc.
Gould Inc.
Swabey Ogilvy Renault
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