Heat pipe thermal management apparatus

Details Heat pipe thermal management apparatus Heat pipe thermal management apparatus

H - Electricity

01

L

H01L 23/427 (2006.01) H01L 23/373 (2006.01)

Patent

CA 2309630

A thermal management apparatus comprising a heat pipe component in thermal communication with a molded heat sink component. In a preferred embodiment, the heat sink comprises a filled, thermally conductive, liquid crystal polymer or thermoset resin. Preferably, the thermal management apparatus will be formed as a unitary structure by an insert molding operation.

Appareil de gestion thermique qui comporte un caloduc en communication thermique avec un puits de chaleur moulé. Dans un mode de réalisation préféré, le puits de chaleur comporte un polymère à cristaux liquides ou une résine thermodurcie thermiquement conducteurs comportant une charge. De préférence, ledit appareil est formé en tant que structure d'une seule pièce par une opération de surmoulage.

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