Beryllium-free high-strength copper alloys

Details Beryllium-free high-strength copper alloys Beryllium-free high-strength copper alloys

C - Chemistry, Metallurgy

22

C

C22C 9/06 (2006.01) C22F 1/08 (2006.01)

Patent

CA 2754211

A beryllium-free high-strength copper alloy includes, about 10-30 vol % of L12- (Ni,Cu)3(Al,Sn), and substantially excludes cellular discontinuous precipitation around grain boundaries. The alloy may include at least one component selected from the group consisting of: Ag, Cr, Mn, Nb, Ti, and V, and the balance Cu.

La présente invention se rapporte à un alliage de cuivre à haute résistance et sans béryllium. Ledit alliage comprend environ de 10 à 30 % en volume de L1 2- (Ni,Cu)3(Al,Sn), et empêche sensiblement la précipitation cellulaire discontinue autour des joints de grain. L'alliage peut comprendre au moins un composant sélectionné dans le groupe constitué par : l'argent (Ag), le chrome (Cr), le manganèse (Mn), le niobium (Nb), le titane (Ti) et le vanadium (V), le reste étant du cuivre (Cu).

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