C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 77/00 (2006.01) C08K 11/00 (2006.01) C08L 23/08 (2006.01) C08L 31/04 (2006.01)
Patent
CA 2496087
The invention relates to molded flexible polyamide materials containing polyamide and olefin/vinyl acetate copolymers, films and hollow elements comprising at least one layer of said molded materials, and methods for producing the molded materials, films, and hollow elements.
La présente invention concerne des matières à mouler polyamides flexibles contenant du polyamide et des copolymères d'oléfines et d'acétate de vinyle, ainsi que des films ou des corps creux comprenant au moins une couche constituée de ces matières à mouler et des procédés de production de ces matières à mouler et de ces films et corps creux.
Hoch Martin
Mahlke Matthias
Parg Roland
Schaefer Marcus
Schulte Helmut
Fetherstonhaugh & Co.
Lanxess Deutschland Gmbh
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