Tungsten-copper composite powder

C - Chemistry – Metallurgy – 22 – C

Patent

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Details

C22C 27/04 (2006.01) B22F 1/02 (2006.01) C22C 1/04 (2006.01) C22C 9/00 (2006.01)

Patent

CA 2551256

A high performance W-Cu composite powder is provided which is composed of individual particles having a tungsten phase and a copper phase wherein the tungsten phase substantially encapsulates the copper phase. The tungsten-coated copper composite powder may be pressed and sintered into W-Cu pseudoalloy articles having a homogeneous distribution of W and Cu phases without experiencing copper bleedout or it may be used in ceramic metallization for the electronics industry.

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