Fungicidal compositions based on copper salts

Details Fungicidal compositions based on copper salts Fungicidal compositions based on copper salts

A - Human Necessities

01

N

A01N 37/40 (2006.01) A01N 25/14 (2006.01) A01N 59/20 (2006.01) A01P 3/00 (2006.01)

Patent

CA 2748734

Fungicidal compositions are described, comprising: A) a copper salicylate having the following molecular formula (I) : C7H4O3Cu(H2O)n (I) wherein n represents 0, 1, 2 or 3; B) copper hydroxide Cu(OH)2 (H); C) a copper salt having the follow-ing formula (III) : 3Cu(OH)2-X(Y)m (III) wherein: X represents cupric ion Cu2+ or calcium ion Ca 21; Y means chloride ion Cl- or sulphate ion SO4 2-; m is an integer equal to 1 or 2; optionally in the presence of dispersants, diluents, surfactants and/or co-formu-lants agronomically acceptable, and the relative agronomical formulations. The use of these fungicidal compositions and agro-nomical formulations for the control of phytopathogenic fungi in agricultural crops, is also described.

L'invention porte sur des compositions fongicides, comprenant : A) un salicylate de cuivre ayant la formule moléculaire (I) suivante : C7H4O3Cu-(H2O)n (I), dans laquelle n représente 0, 1, 2 ou 3; B) un hydroxyde de cuivre Cu(OH)2(H); C) un sel de cuivre ayant la formule (III) suivante : 3Cu(OH)2-X(Y)m (III), dans laquelle : - X représente l'ion cuivrique Cu2+ ou l'ion calcium Ca2+ ; - Y désigne l'ion chlorure Cl- ou l'ion sulfate SO4 2- ; - m est un entier égal à 1 ou à 2; éventuellement, en présence de dispersants, de diluants, de tensioactifs et/ou de co-formulants acceptables sur le plan agronomique, et des formulations agronomiques associées. L'invention porte également sur l'utilisation de ces compositions fongicides et de ces formulations agronomiques pour lutter contre les champignons phytopathogènes dans des cultures agricoles.

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